John H. Lau

John H. Lau received his PhD in theoretical and applied mechanics from the University of Illinois, an MASc in structural engineering from the University of British Columbia, a second MS in engineering physics from the University of Wisconsin, and a third MS in management science from Fairleigh Dickinson University. He also has a BE in civil engineering from National Taiwan University. John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of optoelectronic packaging and manufacturing technology.
Prior to coming to Agilent, Lau worked for Express Packaging Systems, Hewlett-Packard, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, photonics, petroleum, nuclear, and defense industries, he has given over 200 workshops and invited presentations, authored and coauthored over 200 peer-reviewed technical publications, authored more than 100 book chapters, and is the author and editor of 14 books on IC packaging.
Lau has served on the editorial boards of IEEE Transactions on Components, Packaging and Manufacturing Technology, and ASME Transactions, Journal of Electronic Packaging. He also has served as general chairman, program chairman, session chairman, and invited speaker at several ASME, IEEE, ASM, MRS, IMAPS, SEMI, and SMI International conferences. He has received many awards from the ASME and IEEE for best proceedings and transactions papers and outstanding technical achievements and is one of the distinguished lecturers of the ASME and IEEE/CPMT. He is an ASME Fellow and IEEE Fellow and is listed in American Men and Women of Science and Whos Who in America.