Ning Cheng Lee
Biographie de Ning Cheng Lee
Ning-Cheng Lee is the vice president of technology of
Indium Corporation of America. He has been with Indium
since 1986. Prior to joining Indium, he was with Wright
Patterson Air Force Base Materials Laboratory (1981 to
1982), Morton Chemical (1982 to 1984), and SCM (1984 to
1986). He has more than 18 years of experience in the
development of fluxes and solder pastes for SMT industries.
In addition, he also has very extensive experience in the
development of high-temperature polymers, encapsulants for
microelectronics, underfills, and adhesives. His current
research interests cover advanced materials for
interconnects and packaging for electronics and
optoelectronics applications, with emphasis on both high
performance and low cost of ownership.
Lee received his PhD in polymer science and
structure-property relationships from the University of
Akron in 1981. He also studied organic chemistry at Rutgers
University in 1976 and received a BS in chemistry from
National Taiwan University in 1973.
Lee is the author and coauthor of several books on
electronic packaging technologies. He received two awards
from SMTA and one from SMT magazine for best proceedings
papers of international conferences. He also served on the
editorial advistory boards of Soldering and Surface Mount
Technology and Global SMT and Packaging. He has been
published in numerous publications and frequently gives
presentations, invited seminars, keynote speeches, and
short courses worldwide at many international conferences
or symposiums.
Livres de Ning Cheng Lee
Auteurs : John H. Lau, C.P. Wong, Ning Cheng Lee, S.W. Ricky Lee
Éditeur : Mc Graw Hill
Date de parution : 07/10/2002
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