S.W. Ricky Lee

Currently, Lee is associate professor of mechanical engineering and director of EPACK Lab at HKUST. He is an associate editor of IEEE Transactions on Components and Packaging Technologies and also sits on the editorial advisory boards of two international journals: Soldering and Surface Mount Technology and Smart Materials and Structures. In 1997 to 1998, he served as guest editor for Smart Materials and Structures, and published a special issue on piezoelectric motors/actuators and their applications. Lee is very active in professional societies. He is a member of Tau Beta Pi, the ASME, IMAPS, and a senior member of the IEEE. He was the vice-chair of the Hong Kong Section of ASME International (1997 to 1998) and is chair of the Hong Kong Chapter of the IEEE-CPMT Society (2001 to 2002). He is also a member of the executive committee of the Electronic and Photonic Packaging Division of the ASME. Lee has served as track organizer and session chair for many interntional conferences and sits on the program committee (interconnections) of the Electronic Components and Technology Conference. Furthermore, he is quite keen on continuing education for professional development. He has organized several workshops and short courses, and has been invited to deliver short courses and seminars around the world.
Lees recent research activities cover flip chip and CSP technologies, wafer-level packaging, high-density interconnects, and mechanics for sensors and actuators. He has published numerous technical papers in international journals and conference proceedings, and is the coauthor of three books. He is a two-time recipient of the JEP Best Paper Award (2000 and 2001), conferred by ASME Transactions: Journal of Electronic Packaging, and owns one U.S. patent.