
S.W. Ricky Lee
Biographie de S.W. Ricky Lee
Currently, Lee is associate professor of mechanical
engineering and director of EPACK Lab at HKUST. He is an
associate editor of IEEE Transactions on Components and
Packaging Technologies and also sits on the editorial
advisory boards of two international journals: Soldering
and Surface Mount Technology and Smart Materials and
Structures. In 1997 to 1998, he served as guest editor for
Smart Materials and Structures, and published a special
issue on piezoelectric motors/actuators and their
applications. Lee is very active in professional societies.
He is a member of Tau Beta Pi, the ASME, IMAPS, and a
senior member of the IEEE. He was the vice-chair of the
Hong Kong Section of ASME International (1997 to 1998) and
is chair of the Hong Kong Chapter of the IEEE-CPMT Society
(2001 to 2002). He is also a member of the executive
committee of the Electronic and Photonic Packaging Division
of the ASME. Lee has served as track organizer and session
chair for many interntional conferences and sits on the
program committee (interconnections) of the Electronic
Components and Technology Conference. Furthermore, he is
quite keen on continuing education for professional
development. He has organized several workshops and short
courses, and has been invited to deliver short courses and
seminars around the world.
Lees recent research activities cover flip chip and CSP
technologies, wafer-level packaging, high-density
interconnects, and mechanics for sensors and actuators. He
has published numerous technical papers in international
journals and conference proceedings, and is the coauthor of
three books. He is a two-time recipient of the JEP Best
Paper Award (2000 and 2001), conferred by ASME
Transactions: Journal of Electronic Packaging, and owns one
U.S. patent.
Livres de S.W. Ricky Lee
Auteurs : John H. Lau, C.P. Wong, Ning Cheng Lee, S.W. Ricky Lee
Éditeur : Mc Graw Hill
Date de parution : 07/10/2002
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