Microvias
For Low Cost, High Density Interconnects
Résumé
This one-stop guide meets the reference needs of design, materials, process, equipment, manufacturing, reliability, component, packaging, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of microvia and WLCSP technologies. Among the topics explored:
- IC trends and their packaging technology updates
- Design, materials, imaging, drilling, plating, etching, solder resist, machining, and routing of conventional PCB technologies
- Mechanical drilling for microvias
- Materials, mechanisms, tools, and processes for making microvias with Excimer, UC:YAG, and CO2 laser drilling
- Microvias formed by various photoimageable dielectrics and fine-line lithography
- Chemical- and plasma-etched microvias
- Conductive paste/ink-filled microvias
- Thin-film high-density interconnects for WLCSP applications
- Solders for the next generation of WLCSPs
- Creep of solders under combined loads
- Low-alpha-particle-bearing solders
- Lead-free solders
- Wafer bumping (by electroplating and stencil printing methods) with lead-free solders
- Assembly of flip chip on high-density PCBs or substrates with reworkable underfills and with no-flow underfills
- Solder-joint reliability of WLCSP on microvia build-up or substrates
Contents
- Chapter 1: Introduction to Microvia and WLCSP Technologies.
- Chapter 2: Conventional Printed Circuit Board Technologies.
- Chapter 3: Microvias by Mechanical Drilling.
- Chapter 4: Microvias by Laser Drilling.
- Chapter 5: Microvias by Photoimaging.
- Chapter 6: Microvias by Etching.
- Chapter 7: Conductive Paste/Ink-Filled Microvias.
- Chapter 8: Special High-Density Interconnects for Flip Chip Applications.
- Chapter 9: Solders for Next-Generation High-Density Interconnects.
- Chapter 10: Solder-Bumped Flip-Chip WLCSP.
- Chapter 11: Assembly of Flip Chip on PCB/Substrate.
- Chapter 12: Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates
L'auteur - John H. Lau
John H. Lau received his PhD in theoretical and applied
mechanics from the University of Illinois, an MASc in
structural engineering from the University of British
Columbia, a second MS in engineering physics from the
University of Wisconsin, and a third MS in management
science from Fairleigh Dickinson University. He also has a
BE in civil engineering from National Taiwan University.
John is an interconnection technology scientist at Agilent
Technologies, Inc. His current interests cover a broad
range of optoelectronic packaging and manufacturing
technology.
Prior to coming to Agilent, Lau worked for Express
Packaging Systems, Hewlett-Packard, Sandia National
Laboratory, Bechtel Power Corporation, and Exxon Production
and Research Company. With more than 30 years of R&D
and manufacturing experience in the electronics, photonics,
petroleum, nuclear, and defense industries, he has given
over 200 workshops and invited presentations, authored and
coauthored over 200 peer-reviewed technical publications,
authored more than 100 book chapters, and is the author and
editor of 14 books on IC packaging.
Lau has served on the editorial boards of IEEE Transactions
on Components, Packaging and Manufacturing Technology, and
ASME Transactions, Journal of Electronic Packaging. He also
has served as general chairman, program chairman, session
chairman, and invited speaker at several ASME, IEEE, ASM,
MRS, IMAPS, SEMI, and SMI International conferences. He has
received many awards from the ASME and IEEE for best
proceedings and transactions papers and outstanding
technical achievements and is one of the distinguished
lecturers of the ASME and IEEE/CPMT. He is an ASME Fellow
and IEEE Fellow and is listed in American Men and Women of
Science and Whos Who in America.
Caractéristiques techniques
| PAPIER | |
| Éditeur(s) | Mc Graw Hill |
| Auteur(s) | John H. Lau, S.W. Ricky Lee |
| Parution | 01/06/2001 |
| Nb. de pages | 565 |
| Format | 15,5 x 23,5 |
| Couverture | Relié |
| Poids | 1087g |
| Intérieur | Noir et Blanc |
| EAN13 | 9780071363273 |
Avantages Eyrolles.com
Consultez aussi
- Les meilleures ventes en Graphisme & Photo
- Les meilleures ventes en Informatique
- Les meilleures ventes en Construction
- Les meilleures ventes en Entreprise & Droit
- Les meilleures ventes en Sciences
- Les meilleures ventes en Littérature
- Les meilleures ventes en Arts & Loisirs
- Les meilleures ventes en Vie pratique
- Les meilleures ventes en Voyage et Tourisme
- Les meilleures ventes en BD et Jeunesse
