Failure-Free Integrated Circuit Packages

Charles Cohn, Charles A. Harper

288 pages, parution le 10/09/2004

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Résumé

Driven by the fast-growing market for personal electronic devices, integrated circuit complexity has increased as feature sizes shrink. The resulting integrated circuit devices are prone to more frequent failures, which must be found, identified, and fixed. This unique reference uses graphic illustrations to clearly identify all major failure mode types, allowing engineers to spot failures before they occur.

Key features

State of the art failure analysis techniques
Surface mount failure modes
Printed circuit board interconnections

L'auteur - Charles A. Harper

Charles A. Harper is President of Technology Seminars, Inc., an organization that has provided educational seminars to the industry for over twenty years. An engineering graduate of The Johns Hopkins University, where he has also served as an adjunct professor, Mr. Harper has held leadership roles in many professional societies and organizations and is a Fellow of the Society for the Advancement of Materials and Process Engineering. He is the author or editor of numerous books in the plastics and materials fields.

Sommaire

Introduction
Fundamentals of IC Package Technologies
Device Reliability
Physics and Chemistry of Failures in Packaged Devices
Strategies for Locating Failures
Failure Analysis Techniques
Examples of Failure Modes Common in Organic IC Packages
Emerging Assembly Materials for IC Packaging

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Caractéristiques techniques

	PAPIER
Éditeur(s)	Mc Graw Hill
Auteur(s)	Charles Cohn, Charles A. Harper
Parution	10/09/2004
Nb. de pages	288
Format	15,5 x 23,5
Couverture	Relié
Poids	680g
Intérieur	Noir et Blanc
EAN13	9780071434843
ISBN13	978-0-07-143484-3