Microsystems packaging

Rao R Tummala

967 pages, parution le 01/06/2001

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Résumé

Learn about microsystems packaging from the ground up.

Written by Rao Tummala, the field's leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems.

You'll find:

Full coverage of electrical, mechanical, chemical, and materials aspects of each technology Easy-to-read schematics and block diagrams Fundamental approaches to all system issues Examples of all common configurations and technologies--wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes Basics of electrical and reliability testing

Chapter 1: Introduction to Microsystems Packaging
Chapter 2: Microelectronics and Packaging: The Relationship Between The Two
Chapter 3: The Role of Packaging in Microsystems
Chapter 4: Fundamentals of Electrical Package Design
Chapter 5: Fundamentals of Package Design for Reliability
Chapter 6: Fundamentals of Thermal Management
Chapter 7: Fundamentals of Single Chip Packaging
Chapter 8: Funamentals of Multichip Modules and Packaging Technologies
Chapter 9: Fundamentals of IC Assembly
Chapter 10: Fundamentals of Water-Level Packaging
Chapter 11: Fundamentals of Discrete, Integrated, and Embedded Passives
Chapter 12: Fundamentals of Optoelectronics
Chapter 13: Fundamentals of RF Packaging
Chapter 14: Fundamentals of Microelectromechanical Systems
Chapter 15: Fundamentals of Sealing and Encapsulation
Chapter 16: Fundamentals of System-Level PWB Technologies
Chapter 17: Fundamentals of Board Assembly
(and more...)

Caractéristiques techniques

	PAPIER
Éditeur(s)	Mc Graw Hill
Auteur(s)	Rao R Tummala
Parution	01/06/2001
Nb. de pages	967
Format	19 x 24
Couverture	Relié
Poids	1602g
Intérieur	Noir et Blanc
EAN13	9780071371698
ISBN13	978-0-07-137169-8