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Computer modeling of heat and fluid flow materials processing
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Computer modeling of heat and fluid flow materials processing

Computer modeling of heat and fluid flow materials processing

Chun-Pyo Hong - Collection Series in Materials Science and Engineering

258 pages, parution le 09/06/2004

Résumé

The understanding and control of transport phenomena in materials processing play an important role in the improvement of conventional processes and in the development of new techniques. Computer modeling of these phenomena can be used effectively for this purpose. Although there are several books in the literature covering the analysis of heat transfer and fluid flow, this title specifically addresses the understanding of these phenomena in materials processing situations.

This book is aimed at those wishing to learn how to approach computer modeling of transport phenomena and apply these techniques in materials processing. The book will enable the reader to utilize commercially available software, and to develop tailored simulation software for the processes under consideration. The text includes a number of relevant case studies and each chapter is supported by numerous examples of transport modeling programs.

The book is intended for senior undergraduate and graduate students in materials science and engineering, but will also serve as a useful reference for researchers and engineers working in the fields of materials processing and manufacturing.

Sommaire

  • Mechanisms of transport phenomena
  • Governing equations for transport phenomena
  • Similarities among three types of transport phenomena
  • Basics of finite difference methods
  • Steady state heat conduction
  • Transient heat conduction
  • Phase change problems
  • Discretization schemes for convection and diffusion terms
  • Solution algorithms for fluid flow analysis
  • Fluid Flow analysis using the SIMPLE method based on the Cartesian coordinate system
  • Fluid flow analysis using the SIMPLE method based on the body-fitted coordinate system
  • Modelling of mould filling
  • Modelling of microstructure evolution
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Caractéristiques techniques

  PAPIER
Éditeur(s) Institute of Physics (IOP)
Auteur(s) Chun-Pyo Hong
Collection Series in Materials Science and Engineering
Parution 09/06/2004
Nb. de pages 258
Format 15,5 x 23,5
Couverture Broché
Poids 470g
Intérieur Noir et Blanc
EAN13 9780750304450
ISBN13 978-0-7503-0445-0

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