Coombs' Printed Circuit Handbook

• The "bible" of printed circuit board (PCB) technology, revised by Clyde F. Coombs, Jr., the author of the original edition
• Describes the processes used to make today's micro-PCBs and shows how they differ from past techniques

THE ONLY SINGLE- VOLUME REFERENCE ON ALL ASPECTS OF PRINTED CIRCUIT TECHNOLOGY

Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability. COOMBS' PRINTED CIRCUITS HANDBOOK features:

• 30-years' stature as the best reference in the field
• Complete, definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes
• Exhaustive coverage of HDI (High Density Interconnect) technologies including design, material, and microvia fabrication, sequential lamination, assembly, testing, and reliability
• Fabrication developments including blind and buried vias, controlled depth drilling, direct imaging, horizontal and pulse plating
• Base materials, including traditional and alternative laminates
• Effective quality and reliability programs, including test & inspection, acceptability criteria, reliability of boards and assemblies, process capability and control
• Multi-layer and flexible printed circuit design, fabrication and assembly
• Advanced single- and multi-chip component packaging
• Top contributors from Motorola, Cisco, Compaq, Agilent, Hewlett-Packard, and other major companies
• CD-ROM with the entire book in searchable format
• Over 1300 pages covering every facet of PCB work
• More than 700 illustrations, charts, tables, and formulas that provide ready access to needed data

• The most trusted, complete, and up-to-date reference on printed circuit boards
• Ideal for broadening your expertise and for solving problems that arise every day; basics for novices and advanced technologies for experienced practitioners
• Inside: fundamentals of printed circuit design, fabrication, assembly, test, and quality

• Apply leading-edge techniques in design, fabrication, and assembly
• Solve density/heat issues
• Easily find needed data and equations

Advancements in semiconductor packaging have caused a "Density Revolution" in printed circuit technology, leading to dramatic process innovations in all areas of the industry. Now COOMBS' PRINTED CIRCUITS HANDBOOK, the best-selling reference in the field for 30 years, updates you on PCB design and manufacturing processes, with details from leading engineers. Their revolutionary microvia and miniaturization processes are the heart of this new edition

Contents

PART 1: INTRODUCTION TO PRINTED CIRCUITS

• Chapter 1: Electronic Packaging and High-Density Interconnectivity
• Chapter 2: Semiconductor Packaging Technology
• Chapter 3: Advanced Packaging
• Chapter 4: Types of Printed Wiring Boards

• Chapter 5: Introduction to Base Materials
• Chapter 6: Base Material Components
• Chapter 7: Base Material Manufacturing Processes
• Chapter 8: Properties of Base Materials
• Chapter 9: Densification Issues for Base Materials
• Chapter 10: Introducing Base Materials into the PCB Manufacturing Process
• Chapter 11: HDI Microvia Materials
• Chapter 12: Laminate Qualification and Testing

• Chapter 13: Physical Characteristics of PCB
• Chapter 14: The PCB Design Process
• Chapter 15: Electrical and Mechanical Design Parameters
• Chapter 16: Controlled Impedance
• Chapter 17: Multilayer Design Issues
• Chapter 18: Planning for Design, Fabrication, and Assembly
• Chapter 19: Manufacturing Information Documentation and Transfer
• Chapter 20: Electronic Contract Manufacturing Supplier Selection and Management

• Chapter 21: Introduction to High-Density Interconnection Technology
• Chapter 22: High-Density Interconnect-Build-up Technologies
• Chapter 23: Microvia Hole Technologies

• Chapter 24. Drilling Processes
• Chapter 25. High-Density Interconnect Drilling
• Chapter 26. Imaging
• Chapter 27. Multilayer Materials and Processing
• Chapter 28. Preparing Boards for Plating
• Chapter 29. Electroplating
• Chapter 30. Direct Plating
• Chapter 31. PWB Manufacture Using Fully Electroless Copper
• Chapter 32. Surface Finishes
• Chapter 33. Etching Process and Technologies
• Chapter 34. Solder Resist Material and Processes
• Chapter 35. Machining and Routing
• Chapter 36. Process Capability and Control
• Chapter 37. Bare Board Test Objectives and Definitions
• Chapter 38. Bare Board Test Methods
• Chapter 39. Bare Board Test Equipment
• Chapter 40. HDI Bare Board Special Testing Methods

• Chapter 41. Assembly Processes

• Chapter 42. Design for Soldering and Solderability
• Chapter 43. Solder Materials and Processes
• Chapter 44. No-Clean Assembly Process
• Chapter 45. Lead-Free Soldering
• Chapter 46. Fluxes and Cleaning
• Chapter 47. Press-Fit Connections

• Chapter 48. Acceptability of Fabricated Boards
• Chapter 49. Acceptability of Printed Circuit Board Assemblies
• Chapter 50. Assembly Inspection
• Chapter 51. Design for Testing
• Chapter 52. Loaded Board Testing
• Chapter 53. Reliability of Printed Circuit Assemblies
• Chapter 54. Component-to-PWB Reliability

• Chapter 55. Process Waste Minimization and Treatment

• Chapter 56. Flexible Circuits: Applications and Materials
• Chapter 57. Design of Flexible Circuits
• Chapter 58. Manufacturing of Flexible Circuits
• Chapter 59. Termination of Flexible Circuits
• Chapter 60. Special Constructions of Flexible Circuits
• Chapter 61. Quality Assurance of Flexible Circuits