
Résumé
Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process wi th this well-illustrated comprehensive tutorial.
Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process wi th this well-illustrated comprehensive tutorial.
ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.
Contents
- Preface
- Chapter 1: Printed Circuit History and Overview
- Chapter 2: Development and Fabrication of IC Chips
- Chapter 3: Packaging of IC Chips
- Chapter 4: Laminates and Prepregs as Circuit Board Base Materials
- Chapter 5: Printed Circuit Board Fabrication
- Chapter 6: Package and Component Attachment and Interconnection
- Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication
- Chapter 8: Printed Wiring Board Cleaning
- Chapter 9: Board Coating Materials and Processes
- Chapter 10: Flexible and Rigid Flexible Fabrication
- Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites
- Chapter 12: Hybrid Microelectronics and Multichip Module Technologies
- Chapter 13: Environmental Considerations in Electronic Assembly Fabrication
L'auteur - Charles A. Harper
Charles A. Harper is President of Technology Seminars, Inc., an organization that has provided educational seminars to the industry for over twenty years. An engineering graduate of The Johns Hopkins University, where he has also served as an adjunct professor, Mr. Harper has held leadership roles in many professional societies and organizations and is a Fellow of the Society for the Advancement of Materials and Process Engineering. He is the author or editor of numerous books in the plastics and materials fields.
Caractéristiques techniques
PAPIER | |
Éditeur(s) | Mc Graw Hill |
Auteur(s) | Charles A. Harper |
Parution | 02/05/2002 |
Nb. de pages | 672 |
Format | 16 x 23,5 |
Couverture | Relié |
Poids | 1210g |
Intérieur | Noir et Blanc |
EAN13 | 9780071378826 |
ISBN13 | 978-0-07-137882-6 |
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