
Résumé
Micro-miniaturization in electronics a necessity for personal communications devices like cell phones and PDAs has radically altered the materials these electronics are made from.
This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design.
- ALL NEW A complete rewrite of the previous edition
- Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices
- Full materials breakdown for high density packaging techniques
- Materials for communications wiring and cabling
Inside you'll find:
Basic Materials and Processes
- Semiconductors
- Plastics, Elastomers, and Composites
- Ceramics, Glasses, and Diamonds
- Metals
- And more!
Materials Systems
- Circuit Board Processing
- Hybrid Microelectronic Materials and Systems
- Optoelectronic Materials and Systems
- Encapsulants, Underfills, and Molding Compounds for
- High-Density Packaging
- And more!
Contents
- Development and Fabrication of IC Chips
- Plastics, Elastomers, and Composites
- Ceramics and Glasses
- Metals
- Solder Technologies for Electronic Packaging and Assembly
- Electroplating and Deposited Metallic Coatings
- Printed Circuit Board Fabrication
- Materials and Processes for Hybrid Microelectronics and Multichip Modules
- Adhestives Underfills, and Coatings in Electronics Assemblies
- Thermal Management Materials and Systems
- Index
L'auteur - Charles A. Harper
Charles A. Harper is President of Technology Seminars, Inc., an organization that has provided educational seminars to the industry for over twenty years. An engineering graduate of The Johns Hopkins University, where he has also served as an adjunct professor, Mr. Harper has held leadership roles in many professional societies and organizations and is a Fellow of the Society for the Advancement of Materials and Process Engineering. He is the author or editor of numerous books in the plastics and materials fields.
Caractéristiques techniques
PAPIER | |
Éditeur(s) | Mc Graw Hill |
Auteur(s) | Charles A. Harper |
Parution | 17/09/2003 |
Nb. de pages | 800 |
Format | 19 x 24 |
Couverture | Broché |
Poids | 1420g |
Intérieur | Noir et Blanc |
EAN13 | 9780071402149 |
ISBN13 | 978-0-07-140214-9 |
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