Electronic Packaging and Interconnection Handbook

MEMs packaging - Optoelectronic packaging - Chip-scale, flip-chip, and direct-chip attachments

Charles A. Harper - Collection Handbooks

1000 pages, parution le 16/11/2004 (4^eme édition)

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Résumé

The Most Comprehensive Reference In Electronic Packaging-Completely Updated

From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.

Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others.

Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.

Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including:

Materials
Thermal Management
Shock, Vibration, and Operational Stress Management
Connector and Interconnection Technologies
Soldering and Cleaning Technologies
Single Chip Packaging and Ball Grid Arrays
Surface Mount Technology
Hybrid and Multichip Modules
Chip-Scale, Flip-Chip, and Direct-Chip Attachment
Rigid and Flexible Printed-Wiring Boards
Packaging High-Speed and Microwave Systems
Packaging High-Voltage Systems
Packaging of MEMs Systems
Packaging of Optoelectronic Systems

Sommaire

Contributors
Preface
Plastics, Elastomers, and Composites
Adhesives, Underfills, and Coatings
Thermal Management
Connector and Interconnection Technology
Solder Technologies for Electronic Packaging and Assembly
Packaging and Interconnection of Integrated Circuits
Hybrid Microelectronics and Multichip Modules
Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Rigid and Flexible Printed Circuit Board Technology
Packaging of High-Speed and Microwave Electronic Systems
Index

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Caractéristiques techniques

	PAPIER
Éditeur(s)	Mc Graw Hill
Auteur(s)	Charles A. Harper
Collection	Handbooks
Parution	16/11/2004
Édition	4^eme édition
Nb. de pages	1000
Format	19,5 x 24,5
Couverture	Relié
Poids	1856g
Intérieur	Noir et Blanc
EAN13	9780071430487
ISBN13	978-0-07-143048-7