
Electronics manufacturing
with lead-free, halogen-free & conductive-adhesive materials
John H. Lau, C.P. Wong, Ning Cheng Lee, S.W. Ricky Lee
Résumé
This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.
Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies.
Contents
- Introduction to Environmentally Benign Electronics Manufacturing
- Chip (Wafer) - Level Interconnects with Lead-Free Solder Bumps
- WLCSP with Lead-Free Solder Bumps on PCB/Substrate
- Chip (Wafer) - Level Interconnects with Solderless Bumps
- WLCSP with Solderless Bumps on PCB/Substrate
- Environmentally Benign Molding Compounds for IC Packages
- Environmentally Benign Die Attach Films for IC Packaging
- Environmental Issues for Conventional PCBs
- Halogenated and Halogen-Free Materials for Flame Retardation
- Fabrication of Environmentally Friendly PCB
- Global Status of Lead-Free Soldering
- Development of Lead-Free Solder Alloys
- Prevailing Lead-Free Alloys
- Lead-Free Surface Finishes
- Implementation of Lead-Free Soldering
- Challenges for Lead-Free Soldering
- Introduction to Conductive Adhesives
- Conductivity Establishment of Conductive Adhesives
- Mechanisms Underlying the Unstable Contact Resistance of ECAs
- Stabilization of Contact Resistance of Conductive Adhesives
L'auteur - John H. Lau
John H. Lau received his PhD in theoretical and applied
mechanics from the University of Illinois, an MASc in
structural engineering from the University of British
Columbia, a second MS in engineering physics from the
University of Wisconsin, and a third MS in management
science from Fairleigh Dickinson University. He also has a
BE in civil engineering from National Taiwan University.
John is an interconnection technology scientist at Agilent
Technologies, Inc. His current interests cover a broad
range of optoelectronic packaging and manufacturing
technology.
Prior to coming to Agilent, Lau worked for Express
Packaging Systems, Hewlett-Packard, Sandia National
Laboratory, Bechtel Power Corporation, and Exxon Production
and Research Company. With more than 30 years of R&D
and manufacturing experience in the electronics, photonics,
petroleum, nuclear, and defense industries, he has given
over 200 workshops and invited presentations, authored and
coauthored over 200 peer-reviewed technical publications,
authored more than 100 book chapters, and is the author and
editor of 14 books on IC packaging.
Lau has served on the editorial boards of IEEE Transactions
on Components, Packaging and Manufacturing Technology, and
ASME Transactions, Journal of Electronic Packaging. He also
has served as general chairman, program chairman, session
chairman, and invited speaker at several ASME, IEEE, ASM,
MRS, IMAPS, SEMI, and SMI International conferences. He has
received many awards from the ASME and IEEE for best
proceedings and transactions papers and outstanding
technical achievements and is one of the distinguished
lecturers of the ASME and IEEE/CPMT. He is an ASME Fellow
and IEEE Fellow and is listed in American Men and Women of
Science and Whos Who in America.
L'auteur - C.P. Wong
C.P. Wong is a Regents Professor at the School of
Materials Science and Engineering and a Research Director
at the NSF Packaging Research Center at the Georgia
Institute of Technology. He received his BS in chemistry
from Purdue University, and his PhD in chemistry from
Pennsylvania State University with Nobel Laureate Professor
Henry Taube.
Wong spent 19 years at AT&T Bell Labs and was elected a
Bell Labs Fellow in 1992. His research interests lie in the
fields of polymeric materials, reaction mechanism, IC
encapsulation, hermetic equivalent plastic packaging,
electronic packaging processes, interfacial adhesions, PWB,
SMT assembly, and component reliability.
He has received many awards, among which are the AT&T
Bell Laboratories Distinguished Technical Staff Award
(1987), the AT&T Bell Labs Fellow Award (1992), the
IEEE Components, Packaging and Manufacturing Technology
(CPMT) Society Outstanding and Best Paper Awards (1990,
1994, 1996, 1998, and 2002), the IEEE Technical Activities
Board (TAB) Distinguished Award (1994), the IEEE CMPT
Societys Outstanding Sustained Technical Contribution Award
(1995), the Georgia Tech Outstanding Faculty Research
Program Development Award (1999) and many others.
Wong was elected a member of the National Academy of
Engineering in 2000, and he is a Fellow of the IEEE, AIC,
and AT&T Bell Labs. He served as technical vice
president (1990 and 1991) and president (1992 and 1993) of
the IEEE-CPMT Society, the IEEE TAB Management Committee
(1993 to 1994), and chair of IEEE TAB Design and
Manufacturing Committee (1994 to 1996), the IEEE Nomination
and Appointment Committee (1998 to 1999), and the IEEE
Fellow Committee (2001-present).
L'auteur - Ning Cheng Lee
Ning-Cheng Lee is the vice president of technology of
Indium Corporation of America. He has been with Indium
since 1986. Prior to joining Indium, he was with Wright
Patterson Air Force Base Materials Laboratory (1981 to
1982), Morton Chemical (1982 to 1984), and SCM (1984 to
1986). He has more than 18 years of experience in the
development of fluxes and solder pastes for SMT industries.
In addition, he also has very extensive experience in the
development of high-temperature polymers, encapsulants for
microelectronics, underfills, and adhesives. His current
research interests cover advanced materials for
interconnects and packaging for electronics and
optoelectronics applications, with emphasis on both high
performance and low cost of ownership.
Lee received his PhD in polymer science and
structure-property relationships from the University of
Akron in 1981. He also studied organic chemistry at Rutgers
University in 1976 and received a BS in chemistry from
National Taiwan University in 1973.
Lee is the author and coauthor of several books on
electronic packaging technologies. He received two awards
from SMTA and one from SMT magazine for best proceedings
papers of international conferences. He also served on the
editorial advistory boards of Soldering and Surface Mount
Technology and Global SMT and Packaging. He has been
published in numerous publications and frequently gives
presentations, invited seminars, keynote speeches, and
short courses worldwide at many international conferences
or symposiums.
L'auteur - S.W. Ricky Lee
Currently, Lee is associate professor of mechanical
engineering and director of EPACK Lab at HKUST. He is an
associate editor of IEEE Transactions on Components and
Packaging Technologies and also sits on the editorial
advisory boards of two international journals: Soldering
and Surface Mount Technology and Smart Materials and
Structures. In 1997 to 1998, he served as guest editor for
Smart Materials and Structures, and published a special
issue on piezoelectric motors/actuators and their
applications. Lee is very active in professional societies.
He is a member of Tau Beta Pi, the ASME, IMAPS, and a
senior member of the IEEE. He was the vice-chair of the
Hong Kong Section of ASME International (1997 to 1998) and
is chair of the Hong Kong Chapter of the IEEE-CPMT Society
(2001 to 2002). He is also a member of the executive
committee of the Electronic and Photonic Packaging Division
of the ASME. Lee has served as track organizer and session
chair for many interntional conferences and sits on the
program committee (interconnections) of the Electronic
Components and Technology Conference. Furthermore, he is
quite keen on continuing education for professional
development. He has organized several workshops and short
courses, and has been invited to deliver short courses and
seminars around the world.
Lees recent research activities cover flip chip and CSP
technologies, wafer-level packaging, high-density
interconnects, and mechanics for sensors and actuators. He
has published numerous technical papers in international
journals and conference proceedings, and is the coauthor of
three books. He is a two-time recipient of the JEP Best
Paper Award (2000 and 2001), conferred by ASME
Transactions: Journal of Electronic Packaging, and owns one
U.S. patent.
Caractéristiques techniques
PAPIER | |
Éditeur(s) | Mc Graw Hill |
Auteur(s) | John H. Lau, C.P. Wong, Ning Cheng Lee, S.W. Ricky Lee |
Parution | 07/10/2002 |
Nb. de pages | 700 |
Format | 16 x 23,5 |
Couverture | Relié |
Poids | 1216g |
Intérieur | Noir et Blanc |
EAN13 | 9780071386241 |
ISBN13 | 978-0-07-138624-1 |
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