High-Speed Circuit Board Signal Integrity

Stephen C. Thierauf

244 pages, parution le 21/04/2004

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Résumé

As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards.

Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that you can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

L'auteur - Stephen C. Thierauf

Stephen C. Thierauf served as senior consulting hardware engineer at Fabric Networks, Inc. While working at Compaq Computers and Digital Equipment Corporation, he was a senior member of the technical staff responsible for the design and signal integrity analysis of high-speed I/O circuitry and interconnect on the ALPHA microprocessor. Formerly a visiting scholar at Northeastern University, he holds a B.S. in engineering technology from Wentworth College of Technology, Boston, MA.

Sommaire

Characteristics and Construction of Printed Wiring Boards
Resistance of Etched Conductors
Capacitance of Etched Conductors
Inductance of Etched Conductors
Transmission Lines
Return Paths and Power Supply Decoupling
Serial Communication, Loss and Equalization
Single-Ended and Differential Signaling and Crosstalk
Characteristics of Printed Wiring Stripline and Microstrips
Surface Mount Capacitors

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Caractéristiques techniques

	PAPIER
Éditeur(s)	Artech House
Auteur(s)	Stephen C. Thierauf
Parution	21/04/2004
Nb. de pages	244
Format	18 x 26
Couverture	Relié
Poids	605g
Intérieur	Noir et Blanc
EAN13	9781580531313
ISBN13	978-1-58053-131-3