Lia handbook of laser materials processing

Published by the Laser Institute of America, The LIA Handbook of Laser Materials Processing is a working reference source designed to help solve problems by providing extensive data on procedures, processes, equipment, processing systems and processing results. The basic information about the various laser materials processing technologies presented here can help you determine: Their potential effectiveness for your application. Their capabilities and limitations. Their requirements. The numerical values for the laser parameters. The numerical values for the processing results (i.e., penetration depth and processing rates for specified conditions of irradiation). The handbook is broadly structured into three parts: 1. Lasers, optics, accessory instrumentation and laser safety. 2. Industrial laser processing. 3. Electronic and microelectronics processing. Subjects covered include: Choosing a laser Selecting optics Designing beam delivery systems Estimating costs Polarization effects Process gases Cutting Surface Treatments Welding/Brazing/Soldering Drilling Marking and more as shown in the table of contents. The users of this Handbook will include engineers in the manufacturing and electronics areas, materials scientists, optical scientists and physicists in industry and academic research. The handbook will prove indispensable to all who deal with materials process.

Table of Contents

• Chapter 1 Overview of Laser Materials Processing
• Chapter 2 Laser for Materials Processing
• Chapter 3 Optics and Optical Systems
• Chapter 4 Components for laser materials processing systems
• Chapter 5 Laser-Material Interactions
• Chapter 6 Hazard and Safety Considerations
• Chapter 7 Surface Treatment : Heat Treatment
• Chapter 8 Surface Treatment: Glazing, Remelting alloying cladding AND cleaning
• Chapter 9 Brazing/Soldering
• Chapter 10 Conduction Welding
• Chapter 11 Penetration Welding
• Chapter 12 Laser Cutting
• Chapter 13 Hole Drilling
• Chapter 14 Balancing
• Chapter 15 Marking
• Chapter 16 Rapid Prototyping
• Chapter 17 Trimming
• Chapter 18 Laser Marking/Branding
• Chapter 19 Link Cutting/Making
• Chapter 20 Repair
• Chapter 21 Applications in Photolithography
• Chapter 22 Flat Panel Display
• Chapter 23 High-Temperature Superconductors
• Chapter 24 Laser Produced Microstructures
• Chapter 25 Electronic Packaging : Electrical Interconnects
• Chapter 26 Electronic Packaging : Package Sealing and Ceramic Processing
• Chapter 27 Film Deposition and Doping
• Index