RF measurements of die and packages

Scott A. Wartenberg

224 pages, parution le 25/06/2002

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Résumé

The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. An important resource for RFIC designers and high-frequency digital IC designers, IC test engineers, and IC manufacturing test engineers, this ground breaking resource helps you perform high-accuracy RF measurements of die and packages in the RF test lab, employ RF coplanar probes for accurate on-wafer characterization, and troubleshoot and utilize coplanar probes and test fixtures to extend their lifetime. Moreover, the book shows you how to build RF test systems for noise, high-power, and thermal testing, and de-embed the test system's parasitic effects to get the die's RF performance.
This timely resource defines the essential elements in an RF system, explains where errors can be found in such a system, and shows how to mathematically remove them with calibration. It discusses the construction of both coplanar and high-volume testing membrane probes. The book details how to use coplanar probes to characterize individual die on the wafer, describes three popular RF test systems, and concludes with an explanation of how to characterize packages.

Contents

Preface
Introduction
Calibration
Probes and Fixtures
Planarization
Repeatability
Performing Device Characterization
Characterizing Packaged Parts and Empty Packages
Summary: the Future
Appendix

L'auteur - Scott A. Wartenberg

Scott A. Wartenberg is a staff engineer at RF Micro Devices and has done RF/microwave work at Agilent Technologies, Westinghouse, Raytheon, and the U.S. Department of Defense. A senior member of the IEEE and a member of the Microwave Theory and Techniques Society, he holds a Ph.D. and M.S. in Electrical Engineering from the Johns Hopkins University, and a B.S. in Electrical Engineering from the University of Tennessee. He has published extensively.

Caractéristiques techniques

	PAPIER
Éditeur(s)	Artech House
Auteur(s)	Scott A. Wartenberg
Parution	25/06/2002
Nb. de pages	224
Format	15,5 x 23,4
Couverture	Relié
Poids	515g
Intérieur	Noir et Blanc
EAN13	9781580532730
ISBN13	978-1-58053-273-0