Résumé
This comprehensive reference provides the data, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex subdisciplines of semiconductor fundamentals and manufacturing into one volume, it allows the quick look-up of specific reference data.
Key Features
- MEMs technologies
- Cleanroom design and operation
- e-Manufacturing
- Fab design and operation
- Waste management
L'auteur - Hwaiyu Geng
Hwaiyu Geng, CMfgE, P.E. (Palo Alto, California) is a Project Manager of Corporate REWS at Hewlett-Packard Company. His experience in manufacturing engineering is diverse, including work at Applied Materials and Hewlett-Packard's high-tech industries. He has faced many of the challenges facing engineers today, having designed manufacturing processes and facilities for new products, implemented automated manufacturing systems, and established quality, safety, and maintenance programs. He is a Certified Manufacturing Engineer by the Society of Manufacturing Engineers and a Professional Engineer in the State of California. Mr. Geng is also the author of McGraw-Hill's Manufacturing Engineering Handbook.
Sommaire
- Part 1: Semiconductor Fundamentals and Basic Materials
- Chapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin Zhou
- Chapter 2: IC Design - Ilsun Park
- Chapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. Ravi
- Chapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik Chanda
- Chapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. Tu
- Chapter 6: Plasma Process Control - David J. Coumou
- Chapter 7: Vacuum Technology - Peter Biltoft Charles Howard
- Part 2: Wafer Processing
- Chapter 9: Microlithography - Chris A. Mack
- Chapter 10: Ion Implanation and Rapid Thermal Processing - Michael Graf
- Chapter 11: Wet Etching - Peng Zhang
- Chapter 12: Plasma Etching - Shouliang Lai
- Chapter 13: Physical Vapor Deposition - Florian Solzbacher
- Chapter 14: Chemical Vapor Deposition - Edward J. McInerney
- Chapter 15: Epitaxy - Jamal Ramdani, Giovanni Vaccari
- Chapter 16: ECD Fundamentals - Tom Ritzdorf, John Klocks
- Chapter 17: Chemical Mechanical Planarization - Timothy S. Dyer
- Chapter 18: Wet Cleaning - Andrew Machamer
- Part 3: Final Manufacturing
- Chapter 19: Inspection, Measurement, and Test - Donald W. Blair
- Chapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki Otani
- Chapter 21: Packaging - Dietrich Tonnies, Michael Topper
- Part 4: Nanotechnology, MEMS, and FPD
- Chapter 22: Nanotechnology and Nanomanufacturing - Zhong L. Wang
- Chapter 23: Fundamentals of Microelectromechanical Systems - Michael A. Huff
- Chapter 24: Flat-Panel Display Technology and Manufacturing - David N. Liu
- Part 5: Gases and Chemicals
- Chapter 25: Specialty Gas and CDA Systems - Wayne D. Curcie
- Chapter 26: Waste Gas Abatement Systems - Joseph D. Sweeney
- Chapter 27: PFC Abatement - James C. Cox
- Chapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan Barsness
- Chapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. Gould
- Chapter 30: Fundamentals of Ultrapure Water - David J. Albrecht
- Part 6: Fab Yield, Operations, and Facilities
- Chapter 31: Yield Management - Bo Li, Wayne Carriker
- Chapter 32: Automated Material Handling System - Clint Harris
- Chapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina Menaker
- Chapter 34: Six Sigma - Bruno Scibilia, Yoan Dupret
- Chapter 35: Advanced Process Control - Robert H. McCafferty
- Chapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. Trammell
- Chapter 37: Plan, Design, and Construction of a FAB - Industrial Design and Construction
- Chapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. Beck
- Chapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal Amick
- Chapter 40: ESD Controls in Cleanroom Environments - Larry Levit
- Chapter 41: Airborne Molecular Contamination - Chris Muller
- Chapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry Gromala
- Chapter 43: Wastewater Neutralization Systems - Richard E. Pinkowski
Caractéristiques techniques
| PAPIER | |
| Éditeur(s) | Mc Graw Hill |
| Auteur(s) | Hwaiyu Geng |
| Parution | 13/06/2005 |
| Nb. de pages | 800 |
| Format | 19 x 24 |
| Couverture | Relié |
| Poids | 1660g |
| Intérieur | Noir et Blanc |
| EAN13 | 9780071445597 |
| ISBN13 | 978-0-07-144559-7 |
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