Tous nos rayons

Déjà client ? Identifiez-vous

Mot de passe oublié ?

Nouveau client ?

CRÉER VOTRE COMPTE
SiP-System in Package Design and Simulation
Ajouter à une liste

Librairie Eyrolles - Paris 5e
Indisponible

SiP-System in Package Design and Simulation

SiP-System in Package Design and Simulation

Suny li (li yang) (author)

400 pages, parution le 06/09/2017

Résumé

Mr. Suny Li (Li Yang) is a SiP/PCB Technical Specialist in China; he now works in AcconSys Technology Co. Ltd, (a Mentor Authorized Distributor for China). Suny has guided and consulted on dozens of SiP projects in China, accumulating plentiful experience in SiP design and simulation. Suny has 10 years' experience in and knowledge of Application Engineer for Mentor, especially in SiP/PCB design and simulation. Before this, Suny worked in the Chinese Academy of Science and SIEMENS for several years. He has more than seven years' experience in hardware design (HW system design, PCB layout, high-speed signal integrity, power integrity, EMI, etc.). In the course of his work, Suny has published papers and acquired four patents, and he continues with this work. Suny is a senior member of the Chinese Institute of Electronics (CIE) and a member of the IEEE. Suny graduated from Beijing University of Aeronautics & Astronautics (BUAA) in 2000, receiving Master's and Bachelor's degrees in Science and Technology of Aeronautics & Astronautics.

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow

Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. 

Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:  

  • Cavity and sacked dies design
  • FlipChip and RDL design
  • Routing and coppering
  • 3D Real-Time DRC check
  • SiP simulation technology
  • Mentor SiP Design and Simulation Platform

Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. 

TK7874Integrated circuits - Design and construction.|Multichip modules (Microelectronics) - Design and construction.1EnglandChichester, West SussexSuny Li.

Caractéristiques techniques

  PAPIER
Éditeur(s) Wiley
Auteur(s) Suny li (li yang) (author)
Parution 06/09/2017
Nb. de pages 400
Format 154 x 22
Poids 666g
EAN13 9781119045939

Avantages Eyrolles.com

Livraison à partir de 0,01 en France métropolitaine
Paiement en ligne SÉCURISÉ
Livraison dans le monde
Retour sous 15 jours
+ d'un million et demi de livres disponibles
satisfait ou remboursé
Satisfait ou remboursé
Paiement sécurisé
modes de paiement
Paiement à l'expédition
partout dans le monde
Livraison partout dans le monde
Service clients sav.client@eyrolles.com
librairie française
Librairie française depuis 1925
Recevez nos newsletters
Vous serez régulièrement informé(e) de toutes nos actualités.
Inscription