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Lead-Free Electronics

Lead-Free Electronics

Sanka Ganesan, Michael Pecht

766 pages, parution le 03/03/2006

Résumé

Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed:

  • Complying with state legislation
  • Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues
  • Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement
  • Implementing cost effective manufacturing and testing
  • Reducing risks due to tin whiskers
  • Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries
  • Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects
  • Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products

Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach.

With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.

L'auteur - Sanka Ganesan

Sanka Ganesan, PHD, is Associate Research Scientist at the CALCE Electronic Products System Center, University of Maryland. His research interests include advanced materials and interfaces in electronics packages, sensors and MEMS, lead-free electronics, low temperature electronics, and intermittent failures in electronics systems. He has co-authored numerous publications in leading journals and conference proceedings.

L'auteur - Michael Pecht

Michael Pecht, PhD, is Chair Professor, Director, and the founder of the CALCE Electronic Products and Systems Center, University of Maryland. Dr. Pecht is currently Chief Editor of Microelectronics Reliability and has written sixteen books on electronic products development. He has consulted for over fifty major international electronics companies, providing expertise in strategic planning, design, test, IP, and risk assessment of electronic products and systems.

Sommaire

  • Preface
  • Editors
  • Contributors
  • Acknowledgements
  • Lead-Free Electronics: Overview
  • Lead-Free Legislations, Exemptions & Compliance
  • Lead-Free Alloys: Overview
  • Lead-Free Manufacturing
  • Review of Lead-Free Solder Joint Reliability
  • Constitutive Properties and Durability of Selected Lead-Free Solders
  • Interfacial Reactions and Performance of Lead-Free Solder Joints
  • Conductive Adhesives
  • Component-Level Issues in Lead-Free Electronics
  • Tin Whiskers in Electronics
  • Lead-Free Separable Contacts and Connectors
  • Intellectural Property
  • Costs to Lead-Free Migration
  • Lead-Free Technologies in the Japanese Electronics Industry
  • Guidelines for Implementing Lead-Free Electronics
  • Index
Voir tout
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Caractéristiques techniques

  PAPIER
Éditeur(s) Wiley
Auteur(s) Sanka Ganesan, Michael Pecht
Parution 03/03/2006
Nb. de pages 766
Format 16 x 24
Couverture Relié
Poids 1210g
Intérieur Noir et Blanc
EAN13 9780471786177
ISBN13 978-0-471-78617-7

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