MEMS/MOEMS Packaging

Concepts, Designs, Materials, and Processes

Ken Gilleo - Collection Nanoscience & Technology Series

220 pages, parution le 19/09/2005

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Résumé

Authoritative, cost-effective solutions for MEMS and MOEMS assemblies

This is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, electrical performance, thermal management, hermeticity level, and reliability. The author also describes advanced packaging methods, including:

Wafer-level packaging
Microfluidic device packaging
Optical MEMS packaging
RF and microwave packaging
Laser sealing

Readers will find in-depth coverage of assembly technology and manufactura-bility, including cost issues.

Sommaire

Preface
Engineering Fundamentals of MEMS and MOEMS Electronic Packaging
Principles, Materials, and Fabrication of MEMS and MOEMS Devices
MEMS and MOEMS Packaging Challenges and Strategies
MEMS Packaging Processes
MEMS Packaging Materials
From MEMS and MOEMS to Nano Technology
Bibliography
Index

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Caractéristiques techniques

	PAPIER
Éditeur(s)	Mc Graw Hill
Auteur(s)	Ken Gilleo
Collection	Nanoscience & Technology Series
Parution	19/09/2005
Nb. de pages	220
Format	15,5 x 23,5
Couverture	Relié
Poids	477g
Intérieur	Noir et Blanc
EAN13	9780071455565
ISBN13	978-0-07-145556-5