Demystifying Chipmaking

Richard Yanda, Michael Heynes, Anne Miller - Collection Demystifying Technology Series

280 pages, parution le 02/08/2005

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Résumé

This book takes the reader through the actual manufacturing process of making a typical chip, from start to finish, including a detailed discussion of each step, in plain language. The evolution of today's technology is added to the story, as seen through the eyes of the engineers who solved some of the problems. The authors are well suited to that discussion since they are three of those same engineers. They have a broad exposure to the industry and its technology that extends all the way back to Shockley Laboratories, the first semiconductor manufacturer in Silicon Valley.

The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included.

"The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design."

Features & Benefits

Included CD gives the reader a much greater comprehension of the process than a strictly print book with static illustrations provides
Authors are actual engineers who have a broad range of exposure and experience with chip technology
Contains a unique chapter describing the nature of the semiconductor industry from a business perspective

L'auteur - Richard Yanda

Richard Yanda : Semiconductor Services, Redwood City, CA, USA

L'auteur - Michael Heynes

Michael Heynes : Semiconductor Services, Redwood City, CA, USA

Sommaire

IC Fabrication Overview
Support Technologies
Forming Wells
Isolate Active Areas (Shallow Trench Isolation)
Building the Transistors
First Level Metallization
Multilevel Metal Interconnects and Dual Damascene
Test and Assembly
A: Science Overview
B: Plasma Etch Supplement to Chapter 4

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Caractéristiques techniques

	PAPIER
Éditeur(s)	Newnes
Auteur(s)	Richard Yanda, Michael Heynes, Anne Miller
Collection	Demystifying Technology Series
Parution	02/08/2005
Nb. de pages	280
Format	19 x 23
Couverture	Broché
Poids	685g
Intérieur	Noir et Blanc
EAN13	9780750677608
ISBN13	978-0-7506-7760-8