Résumé
Wavelet theory is new to mathematics and has wide
applications in science engineering. Because it lias the
potential to become an important tool in electronic
applications such as packaging, interconnections, antenna
theory, and wireless communications, engineers are
preparing to enter the field in a virtual flood. While
wavelets have been extensively covered from a
mathematician's point of view, this timely text bridges the
gap between mathematical theory and engineering
applications to help engineers exploit the advantages of
wavelets.
Equally valuable as a beginning engineer's guide or as a
reference for experienced engineers and scientists,
Wavelets in Electromagnetics and Device Modeling offers a
quick introduction to the basics of wavelets and then,
without overly complex or abstract mathematics, outlines
applications of wavelets in real-world engineering
problems. Aspects of wavelet theory covered include:
- Basic orthogonal wavelet theory, biorthogonal wavelets, weighted wavelets,
- Special treatment of edges including the periodic wavelets, intervallic wavelets, and Malvar wavelets for the method of moments (MoM)
- Derivation of positive sampling functions and their biorthogonal counterparts employing Daubechies wavelets
- Using the sampling biorthogonal time domain (SBTD) method to improve the finite difference time domain (FDTD) scheme
- Applications in the edge-based finite element method (ULM)
- packaging, and interconnects
- Semiconductor device modeling using wavelets
Contents
- Notations and Mathematical Preliminaries.
- Intuitive Introduction to Wavelets.
- Basic Orthogonal Wavelet Theory.
- Wavelets in Boundary Integral Equations.
- Sampling Biorthogonal Time Domain Method (SBTD).
- Canonical Multiwavelets.
- Wavelets in Scattering and Radiation.
- Wavelets in Rough Surface Scattering.
- Wavelets in Packaging, Interconnects, and EMC.
- Wavelets in Nonlinear Semiconductor Devices.
- Index.
L'auteur - George W. Pan
GEORGE W. PAN, PhD, is Professor of Electrical Engineering and Director of the Electronic Packaging Lab at Arizona State University. He was previously a professor of electrical engineering and director of the Signal Propagation Lab at the University of Wisconsin-Milwaukee. Professor Pan is a senior member of the IEEE and has served as a technical consultant for Boeing Aerospace Co., Cray Research, Mayo Foundation, and other corporations. He is a contributing author to Modeling and Simulation of High Speed VLSI Interconnects.
Caractéristiques techniques
| PAPIER | |
| Éditeur(s) | Wiley |
| Auteur(s) | George W. Pan |
| Parution | 04/03/2003 |
| Nb. de pages | 532 |
| Format | 16 x 24 |
| Couverture | Broché |
| Poids | 900g |
| Intérieur | Noir et Blanc |
| EAN13 | 9780471419013 |
| ISBN13 | 978-0-471-41901-3 |
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