Area array packaging handbook

*Details the pros and cons of each technology with varying applications

*Examines packaging ramifications of high density interconnects (HDI)

The first book to bring BGA, CSP, and Flip Chip together—

teaching design, application, and manufacturing how-to's

As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging.

Look for these highlights inside:

*The hottest technologies in electronics packaging—BGA, CSP, and Flip Chip—all in one reference

*Details on MEMs technology

*Pros and cons of each technology in various applications

*Solutions for difficult packaging ramifications of HDI design concepts

*Detailed coverage of critical reliability and testing issues

*Help with design, materials, and manufacturing processes

*Problem-solving approaches to conception, construction, assembly, and applications

*World-class expert contributors

*400 illustrations

Filled with the hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook gives you an unbeatable resource for success in today's fast-paced world of HDI.

ADVANCES

APPLICATIONS

CONCEPTS

DESIGN

ECONOMICS

OPIMIZATION

EQUIPMENT

FUTURE TECHNOLOGY

MATERIALS

PROCESSES

PRODUCTIVITY

AREA ARRAY PACKAGING AT THE CUTTING EDGE

Table of Contents

• Introduction.
• Chapter 1: Electronics: Industry Overview.
• Chapter 2: Trends/Drivers in the Electronics Mfg. Ind.
• Chapter 3: Area Array Packaging.
• Chapter 4: Chip Scale Packages.
• Chapter 5: Flip Chip Technology.
• Chapter 6: Flex-Based Packaging.
• Chapter 6B: MEMS: Packaging and Assembly Issues.
• Section II: Materials.
• Chapter 7: HDI Organic Substrates.
• Chapter 8: Advances in Ceramics.
• Chapter 9: Polymer Pack.
• Chapter 10: Hermetic Packaging Systems: Adhesives and Getters.
• Chapter 11: Protective Sealants & Coatings.
• Chapter 12: Area Array Solder Spheres, Pastes & Fluxes.
• Chapter 13: Thermal Management Materials and Principles.
• Chapter 14: Modern Solder Pastes.
• Chapter 15: Lead-Free Solders and Their Impact.
• Chapter 15B: Lead-Free Circuit Boards & Components.
• Chapter 16: Conductive Adhesives for SMT and FC.
• Section III: Equipment & Processes.
• 3A: Bare Die.
• Chapter 17: Next Generation Flip Chip Materials & Processing.
• (and more...)